Preparation method of silicon adapter plate and silicon adapter plate

The embodiment of the invention provides a preparation method of a silicon adapter plate and the silicon adapter plate, and the method comprises the steps: carrying out the etching of a silicon wafer, so as to form a silicon through hole in the silicon wafer, and enabling the thickness of the silico...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIU YANCHUN, LI LIWEI, XIAO WENHE, LU YUAN, ZHAO LIFANG, YANG YUNCHUN, LAN CHUANQI, WANG PENGHUI, ZHANG QUNCHAO, QIU JIN, ZHAO HANYANG, GU PEIXIA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING
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