Thin plate laser cutting device

The invention discloses a thin plate laser cutting device which comprises a carrier roller assembly, a ram assembly and a transverse joist assembly, a left limiting device assembly and a right limiting device assembly are arranged below the transverse joist assembly, and a front guide rail assembly...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LI HONG, WANG SHIBING, SUN MIANYU
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The invention discloses a thin plate laser cutting device which comprises a carrier roller assembly, a ram assembly and a transverse joist assembly, a left limiting device assembly and a right limiting device assembly are arranged below the transverse joist assembly, and a front guide rail assembly and a rear guide rail assembly are arranged below the left limiting device assembly and the right limiting device assembly. The left limiting device assembly and the right limiting device assembly each comprise a joist and a power device. The transverse joist assembly comprises a transverse supporting plate and a first guide rail. The ram assembly comprises a lifting seat, a lifting device and a laser cutting machine head; the carrier roller assembly comprises a carrier roller and a carrier roller vertical beam; the front guide rail assembly comprises a second guide rail and a connecting block; the upper surface of the connecting block is connected with the bottom of the supporting beam, the lifting base is connect