Processing method of thick copper circuit board

The invention discloses a processing method of a thick copper circuit board, and relates to the technical field of FPC printed circuit board processing. The method comprises the following steps: selecting FCCL bottom copper, and firstly, accurately calculating an etched line width and an etched line...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WANG TAO, HE ZONGXING, LI QIZHENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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