Processing method of thick copper circuit board

The invention discloses a processing method of a thick copper circuit board, and relates to the technical field of FPC printed circuit board processing. The method comprises the following steps: selecting FCCL bottom copper, and firstly, accurately calculating an etched line width and an etched line distance; accurately calculating the growth proportion of surface copper and side copper at the moment by plating copper on the lead; on the basis of the steps, the circuit board is etched, and the etching line distance and the subsequent copper plating growth influence each other; and after the etching is completed and cleaning is carried out, the processing of the thick copper circuit board is completed. According to the processing method of the thick copper circuit board, common equipment is used for processing the thick copper fine circuit board, special materials are not needed, a product with the copper thickness of 70 microns and the line distance of 40 microns can be processed, and the production cost is c