Semiconductor device

Embodiments provide a semiconductor device capable of enlarging an active region on a chip. According to one embodiment, a semiconductor device includes: a chip; and a gate electrode connected to a gate electrode pad provided on the chip, the gate electrode including: an externally exposed portion having an externally exposed surface coplanar with an externally exposed surface of the sealing resin; and a gate electrode pad connection portion connected to the externally exposed portion and connected to the gate electrode pad. The gate electrode pad connection portion has a portion sandwiched between the gate electrode pad and a portion of the sealing resin. 实施方式提供能够扩大芯片上的有源区的半导体装置。实施方式的半导体装置具备：芯片；以及栅极电极，与设置于所述芯片上的栅极电极焊盘连接，所述栅极电极包括：外部露出部，具有与密封树脂的外部露出面共面的外部露出面；以及栅极电极焊盘连接部，与所述外部露出部相连，与所述栅极电极焊盘连接。所述栅极电极焊盘连接部具有被夹在所述栅极电极焊盘与所述密封树脂的一部分之间的部分。