Large-current thin-film capacitor installed in PCB (Printed Circuit Board)
The invention relates to the technical field of thin-film capacitors, in particular to a high-current thin-film capacitor mounted in a PCB (printed circuit board), which can improve the overcurrent capacity of the capacitor, reduce the heating of the capacitor, increase the contact area with a circu...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention relates to the technical field of thin-film capacitors, in particular to a high-current thin-film capacitor mounted in a PCB (printed circuit board), which can improve the overcurrent capacity of the capacitor, reduce the heating of the capacitor, increase the contact area with a circuit board bonding pad, enhance the welding firmness, improve the vibration resistance and have good stability. A core body is arranged in the shell and is filled with a potting material, and the electric connector is characterized in that the two ends of the core body are respectively welded with an extraction electrode slice, the extraction electrode slices are tightly attached to the outer wall of the shell, the shell is a plastic shell, and the end parts of the extraction electrode slices are exposed out of the potting material and form tooth-shaped insertion slices.
本发明涉及薄膜电容器技术领域,具体为一种安装于PCB电路板中的大电流薄膜电容器,其能够提高电容的过电流能力,降低电容发热,同时增加与电路板焊盘的接触面积,增强焊接牢固度,提高抗振能力,稳定性好,其包括壳体,所述壳体内设置有芯体并填充有灌封料,其特征在于,所述芯体的两端分别焊接有引出电极片且所述引 |
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