Large-diameter multi-layer thick plate boring hole perpendicularity checking device and using method thereof

The invention relates to the field of axis collimation detection, in particular to a large-diameter multi-layer thick plate boring perpendicularity checking device and a use method of the large-diameter multi-layer thick plate boring perpendicularity checking device. The large-diameter multi-layer t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHEN WEI, LIN RENDA, SHI JI'AN, LI HUADONG, SHEN JIE
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to the field of axis collimation detection, in particular to a large-diameter multi-layer thick plate boring perpendicularity checking device and a use method of the large-diameter multi-layer thick plate boring perpendicularity checking device. The large-diameter multi-layer thick plate boring perpendicularity checking device comprises an angle square (3) and is characterized by further comprising sliding blocks (4) and auxiliary brackets (5), each sliding block (4) is movably embedded in a sliding groove (33) through a protruding column in the middle of the sliding block (4), and one auxiliary bracket (5) is fixed to the top of each sliding block (4). The using method of the large-diameter multi-layer thick plate boring perpendicularity checking device is characterized by being implemented according to the following steps in sequence: i, adjusting the distance; ii, laminating; and iii, rotating. The device is simple in structure, convenient to operate and high in measurement precision.