Electroplating shielding device

The invention discloses an electroplating shielding device, a method for manufacturing the electroplating shielding device and an electroplating method using the electroplating shielding device. The electroplating method includes positioning an object in an electroplating shield. The electroplating shield may include a conduit configured to receive the object and a plurality of openings selectively extending between an inner surface and an outer surface of the conduit. The opening may be positioned between the first end and the second end of the conduit. The method may also include forming a layer on the object by transmitting a fluid through the plurality of openings to at least one of a first continuous section of the object including a small portion of the object and a second continuous section of the object including a large portion of the object. The ratio of the thickness of the large portion to the thickness of the small portion after forming the layer may range from about 1: 1 to about 1: 18. 本文公开了一种电