Silicon carbide bonding pug with high thermal shock resistance as well as preparation method and application of silicon carbide bonding pug
The invention discloses high-thermal-shock-resistance silicon carbide bonding pug and a preparation method and application thereof, and the high-thermal-shock-resistance silicon carbide bonding pug is prepared from the following raw materials: main materials and auxiliary materials, the main materia...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses high-thermal-shock-resistance silicon carbide bonding pug and a preparation method and application thereof, and the high-thermal-shock-resistance silicon carbide bonding pug is prepared from the following raw materials: main materials and auxiliary materials, the main material comprises 30-75 wt% of silicon carbide powder, 20-50 wt% of silicon oxide powder and 1-20 wt% of silicon oxide fiber; the auxiliary material comprises a fiber dispersant, an adhesive and water, and relative to the mass of the main material, the use amount of the fiber dispersant is 0-5 wt%, the use amount of the adhesive is 3-20 wt%, and the use amount of the water is 3-20 wt%. The high-thermal-shock-resistance silicon carbide bonding pug has the advantages of being matched with a green body in performance, high in thermal shock resistance, simple in production process and the like, the thermal shock resistance of a silicon carbide honeycomb ceramic body can be improved, and the high-thermal-shock-resistance sili |
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