Resin coating device

Provided is a resin coating device capable of suppressing thickness unevenness when resin is applied to glass fibers in a thin manner. The resin coating device comprises: a through fixed mold; a female die disposed directly below the through fixed die, the female die having a first core adjustment p...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YOSHIKAWA SATOSHI, OISHI KAZUMASA, SHIOZAKI MANABU, MANABE SATOSHI
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:Provided is a resin coating device capable of suppressing thickness unevenness when resin is applied to glass fibers in a thin manner. The resin coating device comprises: a through fixed mold; a female die disposed directly below the through fixed die, the female die having a first core adjustment part, a second core adjustment part, and a first die hole through which the glass fiber is inserted; and a first resin supply path connected to an inlet of the first mold hole, and the second core adjusting part is arranged below the first core adjusting part in the advancing direction of the glass fibers. The first core adjusting part is provided with a first diameter reducing part and a first bearing part; the diameter of the first diameter reducing part is reduced along with descending from the inlet; the first bearing part is connected with the lower part of the first diameter reducing part and has a constant diameter; the second core adjusting part is provided with a second diameter reducing part and a second b