MEMORY PACKAGE AND MEMORY MODULE INCLUDING SAME

A single memory package and a memory module are provided. A single memory package includes: a substrate; and a memory chip and a buffer chip integrated on the substrate, in which the memory chip includes an interface modulator embedded in the memory chip, and the interface modulator is a serialized modulator including a multi-level amplitude modulator. 提供一种单个存储器封装体和存储器模块。单个存储器封装体，包括：基板；以及存储器芯片和缓冲器芯片，该存储器芯片和缓冲器芯片被集成在基板之上，其中，存储器芯片包括被嵌入该存储器芯片中的接口调制器，以及接口调制器是包括多电平幅度调制器的串行化调制器。