Electronic device and method of manufacturing electronic device

In one example, an electronic device includes an embedded module including a module substrate and a module assembly coupled to the module substrate. A device substrate is coupled to the first module substrate. A device terminal is coupled to the module assembly, and a device encapsulant structure encapsulates the embedded module, the device substrate, and the device terminal. A portion of the device substrate is exposed from the device encapsulant structure, and a portion of the device terminal is exposed from the device encapsulant structure. Other examples and related methods are also disclosed herein. 在一个实例中，一种电子装置包含嵌入式模块，所述嵌入式模块包含模块衬底和耦接到所述模块衬底的模块组件。装置衬底耦接到所述第一模块衬底。装置端子耦接到所述模块组件，并且装置包封剂结构包封所述嵌入式模块、所述装置衬底和所述装置端子。所述装置衬底的一部分从所述装置包封剂结构暴露，并且所述装置端子的部分从所述装置包封剂结构暴露。本文中还公开了其它实例和相关方法。