Power semiconductor module and electrical apparatus

The invention provides a power semiconductor module and electrical equipment, the power semiconductor module comprises a metal substrate, a shell, a heat dissipation insulation layer and a chip, the metal substrate is arranged on a heat dissipation bottom plate, the shell is arranged on the metal substrate, and the shell and the metal substrate are enclosed to form a cavity with a through hole; and the edge part of the metal substrate extends to the external space of the shell and is locked with the heat dissipation bottom plate under the action of the locking piece. The heat dissipation insulating layer is arranged in a cavity formed by the shell and located on the side, away from the heat dissipation bottom plate, of the metal substrate, and the chip is arranged in a cavity formed by the shell and located on the side, away from the metal substrate, of the heat dissipation insulating layer. Thus, locking is achieved based on the metal substrate with higher toughness, the problem of cracking can be avoided, t