Prepreg compression molding simulation method and system
The invention provides a prepreg compression molding simulation method and system, and the method comprises the steps: driving an interface heat exchange coefficient between all assemblies in a simulation process through a user-defined subprogram in a rapid temperature rise period in the simulation...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a prepreg compression molding simulation method and system, and the method comprises the steps: driving an interface heat exchange coefficient between all assemblies in a simulation process through a user-defined subprogram in a rapid temperature rise period in the simulation process; wherein the custom subprogram specifically executes the following functions: based on the obtained function representation of the temperature between the components of the prepreg and the mold pressing time, obtaining interface heat exchange coefficients between the components corresponding to different mold pressing time; and in a temperature stationary period in the simulation process, calculating based on a theoretical formula to obtain an interface heat exchange coefficient constant, and driving the interface heat exchange coefficient between the components in the simulation process by using the constant.
本发明提供了一种预浸料模压成型仿真方法及系统,所述方案在仿真过程中的快速升温期,利用自定义子程序驱动仿真过程中各组件之间的界面换热系数;其中,所述自定义子程序具体执行如下功能:基于获得的预浸料各组 |
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