Metal residue removal liquid, method for removing metal residue, and method for manufacturing metal wiring

The present invention pertains to a metal residue removal liquid containing: a mixed solvent (S0) containing a first organic solvent (S1) and a second organic solvent (S2); (F) a salt of hydrofluoric acid and a base that does not contain metal ions; the first organic solvent (S1) is diethylformamide, and the mixed solvent (S0) has a value obtained by subtracting a hydrogen bond term ([delta] H) of a Hansen solubility parameter from a polarity term ([delta] P) of the Hansen solubility parameter of 0.6 or more. 本发明涉及金属残渣去除液，其含有：混合溶剂(S0)，包含第1有机溶剂(S1)及第2有机溶剂(S2)；不含金属离子的碱与氢氟酸的盐(F)；水，所述第1有机溶剂(S1)为二乙基甲酰胺，所述混合溶剂(S0)为从汉森溶解度参数的极性项(δP)减去汉森溶解度参数的氢键项(δH)而得的值为0.6以上的混合溶剂。