Integrated molded body and electronic device housing

Provided is an integrated molded body having excellent thermal conductivity, light weight, and rigidity, in which a laminate having excellent thermal conductivity, light weight, and rigidity is integrated with another member. An integrally molded body according to the present invention is obtained by disposing a structure comprising a thermoplastic resin and reinforcing fibers on the outer periphery of a laminate in which at least a prepreg comprising continuous carbon fibers and a resin is laminated, the thermal conductivity [lambda] 1A in the fiber direction of the continuous carbon fibers of the first prepreg constituting the outermost layer of the laminate is 100 [W/(mK)] or more and 800 [W/(mK)] or less. The invention is preferably used for an electronic device housing. 本发明提供将导热性、轻质性、刚性优异的层叠体与其他部件一体化而成的、导热性、轻质性、刚性优异的一体化成型体。本发明的一体化成型体是在至少层叠有由连续碳纤维和树脂形成的预浸料坯的层叠体的外周部配置由热塑性树脂和增强纤维形成的结构体而成的一体化成型体，构成上述层叠体的最外层的第1预浸料坯的连续碳纤维的纤维方向上的导热率λ1A为100[W/(m·K)]以上800[W/(m·K)]以下。优选用于电子设备壳体。