Integrated circuit device

An integrated circuit (IC) device includes a peripheral circuit structure and a cell array structure. The peripheral circuit structure includes a circuit substrate, a peripheral circuit, a first insulating layer covering the circuit substrate and the peripheral circuit, and a first bonding pad. The cell array structure includes an insulating structure having a first surface and a second surface opposite to each other, a conductive plate on the first surface, a memory cell array on the conductive plate, a second insulating layer, a second bonding pad disposed on the second insulating layer, a first wiring and a second wiring spaced apart from each other on the second surface, a conductive path passing through the insulating structure and connecting the conductive plate to the first wiring, and a contact structure electrically connecting the first wiring to the second bonding pad. The first bonding pad is in contact with the second bonding pad. 一种集成电路(IC)器件包括外围电路结构和单元阵列结构。外围电路结构包括电路基板、外围电路、覆盖电路基板和外围电路的第一绝缘层、以及第