Substrate jig for chip packaging and working method thereof

The invention relates to the field of semiconductor chip packaging and testing, in particular to a substrate jig for chip packaging and a working method of the substrate jig. The invention provides a substrate jig for chip packaging. The substrate jig for chip packaging comprises a jig body and a sample box arranged in the jig body in a split mode. The jig body is internally and horizontally provided with a sliding groove along the opening side. The jig body is further provided with a locking mechanism, and the stroke of the locking mechanism is provided with a first station and a second station. When the sample box pushes the locking mechanism to be located at a first station, the locking mechanism is clamped with the sample box so as to position the sample box; and when the sample box pushes the locking mechanism to be located at the second station, the locking mechanism separates the sample box and pops the sample box out of the jig body. By arranging the locking mechanism, the substrate can be convenientl