Nanoimprint female die structure splicing method
The embodiment of the invention discloses a nanoimprint female die structure splicing method. The method comprises the steps that a template structure of a first nanoimprint female die is imprinted on a wafer through a nanoimprint technology; coating the structural region of the wafer with protectiv...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The embodiment of the invention discloses a nanoimprint female die structure splicing method. The method comprises the steps that a template structure of a first nanoimprint female die is imprinted on a wafer through a nanoimprint technology; coating the structural region of the wafer with protective glue to protect the structural region; the template structure of the second nanoimprint female die is imprinted on the non-structural area of the wafer through the nanoimprint technology; wherein the second nanoimprint female die and the first nanoimprint female die are the same female die or different female dies.
本公开实施例公开了一种纳米压印母模结构拼接方法,该方法包括:通过纳米压印技术将第一纳米压印母模的模板结构压印在晶圆上;将保护胶涂覆在所述晶圆的结构区以保护所述结构区;通过纳米压印技术将第二纳米压印母模的模板结构压印在所述晶圆的非结构区;其中,所述第二纳米压印母模与所述第一纳米压印母模为同一母模或者不同母模。 |
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