Embedded modular rapid development system

Embedded modular rapid development system

The invention relates to the technical field of computers, in particular to an embedded modular rapid development system which comprises a hardware module and a software module. The hardware module comprises a base integration module, an IO core extension module and a UART self-adaptive hot inter-cu...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CHENG GENG, XIANG JICHUN, LIU YANCAI, KOJO, YU
Format: Patent
Sprache:chi ; eng
Schlagworte:
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator CHENG GENG
XIANG JICHUN
LIU YANCAI
KOJO, YU
description The invention relates to the technical field of computers, in particular to an embedded modular rapid development system which comprises a hardware module and a software module. The hardware module comprises a base integration module, an IO core extension module and a UART self-adaptive hot inter-cut module, and the IO core extension module comprises an MCU core piece; the software module is used for carrying out secondary packaging on drive APIs (Application Program Interface) built in MUC core chips with different performances at present according to user requirements, MCU core chip information and MCU core chip resource use conditions, and isolating a part of a classified packaging bottommost layer, if the MCU core chip is replaced, only a hardware drive of the current bottommost layer needs to be updated and modified, and if the MCU core chip is replaced, the hardware drive of the current bottommost layer needs to be updated and modified. When the second layer of middleware function sub-modules is impleme
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN117707636A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN117707636A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN117707636A3</originalsourceid><addsrcrecordid>eNrjZNB0zU1KTUlJTVHIzU8pzUksUihKLMhMUUhJLUvNyS_ITc0rUSiuLC5JzeVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaG5uYG5mbGZo7GxKgBABS6KPI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Embedded modular rapid development system</title><source>esp@cenet</source><creator>CHENG GENG ; XIANG JICHUN ; LIU YANCAI ; KOJO, YU</creator><creatorcontrib>CHENG GENG ; XIANG JICHUN ; LIU YANCAI ; KOJO, YU</creatorcontrib><description>The invention relates to the technical field of computers, in particular to an embedded modular rapid development system which comprises a hardware module and a software module. The hardware module comprises a base integration module, an IO core extension module and a UART self-adaptive hot inter-cut module, and the IO core extension module comprises an MCU core piece; the software module is used for carrying out secondary packaging on drive APIs (Application Program Interface) built in MUC core chips with different performances at present according to user requirements, MCU core chip information and MCU core chip resource use conditions, and isolating a part of a classified packaging bottommost layer, if the MCU core chip is replaced, only a hardware drive of the current bottommost layer needs to be updated and modified, and if the MCU core chip is replaced, the hardware drive of the current bottommost layer needs to be updated and modified. When the second layer of middleware function sub-modules is impleme</description><language>chi ; eng</language><subject>CALCULATING ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; PHYSICS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240315&amp;DB=EPODOC&amp;CC=CN&amp;NR=117707636A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240315&amp;DB=EPODOC&amp;CC=CN&amp;NR=117707636A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHENG GENG</creatorcontrib><creatorcontrib>XIANG JICHUN</creatorcontrib><creatorcontrib>LIU YANCAI</creatorcontrib><creatorcontrib>KOJO, YU</creatorcontrib><title>Embedded modular rapid development system</title><description>The invention relates to the technical field of computers, in particular to an embedded modular rapid development system which comprises a hardware module and a software module. The hardware module comprises a base integration module, an IO core extension module and a UART self-adaptive hot inter-cut module, and the IO core extension module comprises an MCU core piece; the software module is used for carrying out secondary packaging on drive APIs (Application Program Interface) built in MUC core chips with different performances at present according to user requirements, MCU core chip information and MCU core chip resource use conditions, and isolating a part of a classified packaging bottommost layer, if the MCU core chip is replaced, only a hardware drive of the current bottommost layer needs to be updated and modified, and if the MCU core chip is replaced, the hardware drive of the current bottommost layer needs to be updated and modified. When the second layer of middleware function sub-modules is impleme</description><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB0zU1KTUlJTVHIzU8pzUksUihKLMhMUUhJLUvNyS_ITc0rUSiuLC5JzeVhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfHOfoaG5uYG5mbGZo7GxKgBABS6KPI</recordid><startdate>20240315</startdate><enddate>20240315</enddate><creator>CHENG GENG</creator><creator>XIANG JICHUN</creator><creator>LIU YANCAI</creator><creator>KOJO, YU</creator><scope>EVB</scope></search><sort><creationdate>20240315</creationdate><title>Embedded modular rapid development system</title><author>CHENG GENG ; XIANG JICHUN ; LIU YANCAI ; KOJO, YU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117707636A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>CHENG GENG</creatorcontrib><creatorcontrib>XIANG JICHUN</creatorcontrib><creatorcontrib>LIU YANCAI</creatorcontrib><creatorcontrib>KOJO, YU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHENG GENG</au><au>XIANG JICHUN</au><au>LIU YANCAI</au><au>KOJO, YU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Embedded modular rapid development system</title><date>2024-03-15</date><risdate>2024</risdate><abstract>The invention relates to the technical field of computers, in particular to an embedded modular rapid development system which comprises a hardware module and a software module. The hardware module comprises a base integration module, an IO core extension module and a UART self-adaptive hot inter-cut module, and the IO core extension module comprises an MCU core piece; the software module is used for carrying out secondary packaging on drive APIs (Application Program Interface) built in MUC core chips with different performances at present according to user requirements, MCU core chip information and MCU core chip resource use conditions, and isolating a part of a classified packaging bottommost layer, if the MCU core chip is replaced, only a hardware drive of the current bottommost layer needs to be updated and modified, and if the MCU core chip is replaced, the hardware drive of the current bottommost layer needs to be updated and modified. When the second layer of middleware function sub-modules is impleme</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN117707636A
source esp@cenet
subjects CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
title Embedded modular rapid development system
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-26T16%3A30%3A09IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CHENG%20GENG&rft.date=2024-03-15&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN117707636A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true