Embedded modular rapid development system

The invention relates to the technical field of computers, in particular to an embedded modular rapid development system which comprises a hardware module and a software module. The hardware module comprises a base integration module, an IO core extension module and a UART self-adaptive hot inter-cu...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHENG GENG, XIANG JICHUN, LIU YANCAI, KOJO, YU
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to the technical field of computers, in particular to an embedded modular rapid development system which comprises a hardware module and a software module. The hardware module comprises a base integration module, an IO core extension module and a UART self-adaptive hot inter-cut module, and the IO core extension module comprises an MCU core piece; the software module is used for carrying out secondary packaging on drive APIs (Application Program Interface) built in MUC core chips with different performances at present according to user requirements, MCU core chip information and MCU core chip resource use conditions, and isolating a part of a classified packaging bottommost layer, if the MCU core chip is replaced, only a hardware drive of the current bottommost layer needs to be updated and modified, and if the MCU core chip is replaced, the hardware drive of the current bottommost layer needs to be updated and modified. When the second layer of middleware function sub-modules is impleme