Heat-conducting organic silicon composite material for chip packaging and preparation method of heat-conducting organic silicon composite material

The invention discloses a heat-conducting organic silicon composite material for chip packaging and a preparation method of the heat-conducting organic silicon composite material. The heat-conducting organic silicon composite material is prepared from the following components in parts by weight: 100 parts of base adhesive, 1 to 3.1 parts of vinyl-terminated polydimethylsiloxane, 0.1 to 0.5 part of hydrogen-terminated polydimethylmethylhydrosiloxane, 0.01 to 0.07 part of tackifier, 0.02 to 0.1 part of inhibitor and 0.02 to 0.1 part of catalyst. According to the invention, a macromolecular alkoxy silane treating agent with a T-shaped symmetrical structure is adopted to carry out surface modification on a heat-conducting inorganic filler, and brush-like polysiloxane and a tackifier with a special structure are introduced into a cross-linked network of an organic silicon composite material; the prepared heat-conducting organic silicon composite material for chip packaging has excellent properties such as high hea