Wafer cleaning device and wafer cleaning method

The invention relates to the technical field of wafer production, in particular to a wafer cleaning device and a wafer cleaning method.The wafer cleaning device comprises a base, a main support, a transmission mechanism, a polishing mechanism, a slurry discharging mechanism and a cleaning mechanism, the main support is fixedly connected to the top wall of the base, and the transmission mechanism, the polishing mechanism, the slurry discharging mechanism and the cleaning mechanism are all arranged on the main support. Intermittent movement of the transmission groove can be achieved, so that a wafer body can stay below the storage opening and the polishing disc for a period of time in the conveying process, grinding slurry in the storage cavity is intermittently extruded to the wafer body through the extrusion plate, the polishing disc moves downwards to polish the wafer body, the linkage performance is high, and the polishing efficiency is high. The grinding machine is simple in structure and ingenious in desi