Wafer thinning system and method, electronic equipment and storage medium

The embodiment of the invention discloses a wafer thinning system and method, electronic equipment and a storage medium, and the wafer thinning method comprises the steps that for the nth wafer in a batch of to-be-thinned wafers, a grinding module is controlled to grind the nth wafer according to a grinding coefficient, the pressure response coefficient is used for representing the relation between the expected applied pressure and the expected removal rate morphology of each polishing area, the polishing module is controlled to polish the ground wafer for the first time according to the pressure response coefficient, the thinned wafer is obtained, and the pressure response coefficient is used for representing the relation between the expected applied pressure and the expected removal rate morphology of each polishing area; according to the removal rate morphology, corresponding to polishing, of every two adjacent polishing areas in the nth wafer, the pressure response coefficient of each polishing area is up