Complex waveform for electrolytic plating
A method of copper electroplating in the manufacture of a printed circuit board. The method is used for filling through holes and blind micro vias with copper. The method includes the steps of: (1) preparing an electronic substrate to receive copper electroplating thereon; (2) forming at least one o...
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| creator | DESALVO, DANIEL DECESARE WILLIAM J LONG ERNEST WATKOWSKI, JANUSZ BELLEMARE, ROBERT, A GUGLIOTTI CHIARA BREKKE ROGER |
| description | A method of copper electroplating in the manufacture of a printed circuit board. The method is used for filling through holes and blind micro vias with copper. The method includes the steps of: (1) preparing an electronic substrate to receive copper electroplating thereon; (2) forming at least one of one or more through-vias and/or one or more blind micro-vias in the electronic substrate; and (3) electroplating copper in the one or more through-vias and/or the one or more blind micro-vias by contacting the electronic substrate with an acidic copper electrolyte. The acidic copper electrolyte is used to plate the one or more vias and/or the one or more blind micro vias using complex waveforms including pulse reverse plating, DC plating, and/or synchronized pulse plating. These complex waveforms can be used to fill vias and blind micro vias with copper without defects.
一种在印刷电路板的制造中铜电镀的方法。该方法用于用铜填充通孔和盲微过孔。该方法包括以下步骤：(1)制备电子基板以在其上接受铜电镀；(2)在该电子基板中形成一个或多个通孔和/或一个或多个盲微过孔中的至少一者；以及(3)通过使该电子基板与酸性铜电解质接触，在该一个或多个通孔和/或一个或多个盲微 |
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一种在印刷电路板的制造中铜电镀的方法。该方法用于用铜填充通孔和盲微过孔。该方法包括以下步骤：(1)制备电子基板以在其上接受铜电镀；(2)在该电子基板中形成一个或多个通孔和/或一个或多个盲微过孔中的至少一者；以及(3)通过使该电子基板与酸性铜电解质接触，在该一个或多个通孔和/或一个或多个盲微</description><language>chi ; eng</language><subject>APPARATUS THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; PRINTED CIRCUITS ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240312&DB=EPODOC&CC=CN&NR=117693612A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240312&DB=EPODOC&CC=CN&NR=117693612A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DESALVO, DANIEL</creatorcontrib><creatorcontrib>DECESARE WILLIAM J</creatorcontrib><creatorcontrib>LONG ERNEST</creatorcontrib><creatorcontrib>WATKOWSKI, JANUSZ</creatorcontrib><creatorcontrib>BELLEMARE, ROBERT, A</creatorcontrib><creatorcontrib>GUGLIOTTI CHIARA</creatorcontrib><creatorcontrib>BREKKE ROGER</creatorcontrib><title>Complex waveform for electrolytic plating</title><description>A method of copper electroplating in the manufacture of a printed circuit board. The method is used for filling through holes and blind micro vias with copper. The method includes the steps of: (1) preparing an electronic substrate to receive copper electroplating thereon; (2) forming at least one of one or more through-vias and/or one or more blind micro-vias in the electronic substrate; and (3) electroplating copper in the one or more through-vias and/or the one or more blind micro-vias by contacting the electronic substrate with an acidic copper electrolyte. The acidic copper electrolyte is used to plate the one or more vias and/or the one or more blind micro vias using complex waveforms including pulse reverse plating, DC plating, and/or synchronized pulse plating. These complex waveforms can be used to fill vias and blind micro vias with copper without defects.
一种在印刷电路板的制造中铜电镀的方法。该方法用于用铜填充通孔和盲微过孔。该方法包括以下步骤：(1)制备电子基板以在其上接受铜电镀；(2)在该电子基板中形成一个或多个通孔和/或一个或多个盲微过孔中的至少一者；以及(3)通过使该电子基板与酸性铜电解质接触，在该一个或多个通孔和/或一个或多个盲微</description><subject>APPARATUS THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>PRINTED CIRCUITS</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB0zs8tyEmtUChPLEtNyy_KVQASCqk5qcklRfk5lSWZyQoFOYklmXnpPAysaYk5xam8UJqbQdHNNcTZQze1ID8-tbggMTk1L7Uk3tnP0NDczNLYzNDI0ZgYNQAudCkg</recordid><startdate>20240312</startdate><enddate>20240312</enddate><creator>DESALVO, DANIEL</creator><creator>DECESARE WILLIAM J</creator><creator>LONG ERNEST</creator><creator>WATKOWSKI, JANUSZ</creator><creator>BELLEMARE, ROBERT, A</creator><creator>GUGLIOTTI CHIARA</creator><creator>BREKKE ROGER</creator><scope>EVB</scope></search><sort><creationdate>20240312</creationdate><title>Complex waveform for electrolytic plating</title><author>DESALVO, DANIEL ; DECESARE WILLIAM J ; LONG ERNEST ; WATKOWSKI, JANUSZ ; BELLEMARE, ROBERT, A ; GUGLIOTTI CHIARA ; BREKKE ROGER</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN117693612A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2024</creationdate><topic>APPARATUS THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>PRINTED CIRCUITS</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>DESALVO, DANIEL</creatorcontrib><creatorcontrib>DECESARE WILLIAM J</creatorcontrib><creatorcontrib>LONG ERNEST</creatorcontrib><creatorcontrib>WATKOWSKI, JANUSZ</creatorcontrib><creatorcontrib>BELLEMARE, ROBERT, A</creatorcontrib><creatorcontrib>GUGLIOTTI CHIARA</creatorcontrib><creatorcontrib>BREKKE ROGER</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DESALVO, DANIEL</au><au>DECESARE WILLIAM J</au><au>LONG ERNEST</au><au>WATKOWSKI, JANUSZ</au><au>BELLEMARE, ROBERT, A</au><au>GUGLIOTTI CHIARA</au><au>BREKKE ROGER</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Complex waveform for electrolytic plating</title><date>2024-03-12</date><risdate>2024</risdate><abstract>A method of copper electroplating in the manufacture of a printed circuit board. The method is used for filling through holes and blind micro vias with copper. The method includes the steps of: (1) preparing an electronic substrate to receive copper electroplating thereon; (2) forming at least one of one or more through-vias and/or one or more blind micro-vias in the electronic substrate; and (3) electroplating copper in the one or more through-vias and/or the one or more blind micro-vias by contacting the electronic substrate with an acidic copper electrolyte. The acidic copper electrolyte is used to plate the one or more vias and/or the one or more blind micro vias using complex waveforms including pulse reverse plating, DC plating, and/or synchronized pulse plating. These complex waveforms can be used to fill vias and blind micro vias with copper without defects.
一种在印刷电路板的制造中铜电镀的方法。该方法用于用铜填充通孔和盲微过孔。该方法包括以下步骤：(1)制备电子基板以在其上接受铜电镀；(2)在该电子基板中形成一个或多个通孔和/或一个或多个盲微过孔中的至少一者；以及(3)通过使该电子基板与酸性铜电解质接触，在该一个或多个通孔和/或一个或多个盲微</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
| title | Complex waveform for electrolytic plating |
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