Complex waveform for electrolytic plating

A method of copper electroplating in the manufacture of a printed circuit board. The method is used for filling through holes and blind micro vias with copper. The method includes the steps of: (1) preparing an electronic substrate to receive copper electroplating thereon; (2) forming at least one of one or more through-vias and/or one or more blind micro-vias in the electronic substrate; and (3) electroplating copper in the one or more through-vias and/or the one or more blind micro-vias by contacting the electronic substrate with an acidic copper electrolyte. The acidic copper electrolyte is used to plate the one or more vias and/or the one or more blind micro vias using complex waveforms including pulse reverse plating, DC plating, and/or synchronized pulse plating. These complex waveforms can be used to fill vias and blind micro vias with copper without defects. 一种在印刷电路板的制造中铜电镀的方法。该方法用于用铜填充通孔和盲微过孔。该方法包括以下步骤：(1)制备电子基板以在其上接受铜电镀；(2)在该电子基板中形成一个或多个通孔和/或一个或多个盲微过孔中的至少一者；以及(3)通过使该电子基板与酸性铜电解质接触，在该一个或多个通孔和/或一个或多个盲微