Isolation coupling element
The invention discloses an isolation coupling element which comprises a multi-layer printed circuit board (PCB) which comprises an upper layer and a lower layer. A primary coil comprising a first number of turns of conductive traces disposed on the upper peripheral region; and a secondary coil; wher...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses an isolation coupling element which comprises a multi-layer printed circuit board (PCB) which comprises an upper layer and a lower layer. A primary coil comprising a first number of turns of conductive traces disposed on the upper peripheral region; and a secondary coil; wherein the first portion of the secondary coil comprises a second number of turns of conductive traces disposed on an interior region of the upper layer; wherein the second portion of the secondary coil comprises a third number of turns of conductive traces arranged in the lower layer; and wherein the mutual inductance of the isolation coupling element is greater than 50 nH at 100 kHz.
本发明公开了一个隔离耦合元件,包括一个多层印刷电路板PCB,其包括上层、下层;一个初级线圈,其包括设置在上层外围区域上的第一匝数个导电迹线;以及一个次级线圈;其中,所述次级线圈的第一部分包括设置在所述上层的内部区域上的第二匝数个导电迹线;其中,所述次级线圈的第二部分包括布置在所述下层的第三匝数个导电迹线;和其中,所述隔离耦合元件的互感在100kHz时大于50nH。 |
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