Multilayer ceramic system-in-package structure

The invention discloses a multilayer ceramic system-in-package structure, which comprises a ceramic shell, an upper cover plate, a lower cover plate, a microwave chip, a power control chip, a groove, a coplanar waveguide transmission line, a microwave signal layer strip line, a power control circuit...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PAN XIONGWEN, LIU WENZHI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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