Multilayer ceramic system-in-package structure

The invention discloses a multilayer ceramic system-in-package structure, which comprises a ceramic shell, an upper cover plate, a lower cover plate, a microwave chip, a power control chip, a groove, a coplanar waveguide transmission line, a microwave signal layer strip line, a power control circuit group and a quasi-coaxial structure, the ceramic shell comprises a ceramic shell upper layer and a ceramic shell lower layer, substrates of the ceramic shell upper layer and the ceramic shell lower layer form a symmetrical structure, the grooves are formed by grooving the substrates of the ceramic shell, and the microwave chips are pasted in the grooves through conductive adhesive and connected with the coplanar waveguide transmission line through leads. The coplanar waveguide transmission line is connected with the microwave signal layer strip line; the power supply control chip is connected with the power supply control circuit group through a lead, the power supply control circuit group is connected with the mi