Method and apparatus for bonding substrates

The invention relates to a method and a device for bonding two substrates in the technical field of microelectronics and microsystems. In order to improve the bonding quality, in particular the bonding accuracy, at the edge of the substrate, it is proposed that the bonding waves are affected during bonding. The method comprises: a) securing the first and second substrates to respective first and second containment devices, where the first substrate is secured to a first containment face of the first containment device and the second substrate is secured to a second containment face of the second containment device; b) arranging the first substrate and the second substrate relative to each other; c) approaching the first substrate and the second substrate towards each other; d) bringing the first substrate into contact with a second substrate at a bonding start point; e) generating a bonding wave extending from the bonding start point to the side edges of the first and second substrates; f) influencing the bon