Electroplating solution capable of controlling composition ratio of electroplated copper-nickel alloy and electroplating method

The invention discloses an electroplating solution capable of controlling the composition ratio of electroplated copper-nickel alloy and an electroplating method. An electroplating solution capable of controlling the composition ratio of electroplated copper-nickel alloy is composed of a basic elect...

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Bibliographische Detailangaben
Hauptverfasser:	FU LIUYU, LU PEIPEI, PAN ZHANCHANG, HU GUANGHUI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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