Electroplating solution capable of controlling composition ratio of electroplated copper-nickel alloy and electroplating method

The invention discloses an electroplating solution capable of controlling the composition ratio of electroplated copper-nickel alloy and an electroplating method. An electroplating solution capable of controlling the composition ratio of electroplated copper-nickel alloy is composed of a basic electroplating solution and a characteristic adsorbent. The characteristic adsorbent is at least one of hexadecyl trimethyl ammonium bromide, heptadecenyl amine ethyl imidazoline quaternary ammonium salt and heptadecenyl hydroxyethyl imidazoline quaternary ammonium salt; and the basic electroplating solution contains nickel salt, copper salt, a complexing agent and a buffering agent. The components of the electroplating liquid are simple and easy to obtain, and the electroplating process is simple, convenient and easy to operate. Compared with a copper-nickel alloy coating obtained through a common electroplating solution, the copper-nickel alloy ratio of the electroplated copper-nickel alloy coating prepared through th