Flash etching additive for mSAP process and preparation method of flash etching additive

The invention discloses a flash etching additive for an mSAP process and a preparation method of the flash etching additive, and relates to the technical field of printed circuit board production. The flash etching additive for the mSAP process is characterized by comprising the following components according to concentration: 8-60 g/L of a regulator, 2-20 g/L of organic acid, 2-10 g/L of a nonionic surfactant, 0.1-0.4 g/L of a wetting agent and the balance of deionized water. According to the flash etching additive for the mSAP process, non-selective etching of different types of metal copper materials can be achieved, the etching selectivity of a flash etching liquid medicine on a bottom layer copper surface and an electroplating copper surface in the current market is completely improved, and crystal lattices are not loose and have no pinholes after etching. The corrosion performance of the additive can still be kept stable within different corrosion amount and liquid medicine concentration ranges. 本发明公开了一