Solvent-free adhesive for compounding insulating materials and preparation method of solvent-free adhesive

The invention discloses a solvent-free adhesive for compounding an insulating material and a preparation method of the solvent-free adhesive, and belongs to the field of insulating material adhesives. The adhesive comprises a component A and a component B, wherein the mass ratio of the component A to the component B is (1.5-2.0): 1; wherein the component A is prepared from isocyanate, first polyester polyol, diamine, an antioxidant and an ultraviolet absorbent; the component B is prepared from second polyester polyol, a functional monomer, epoxy resin, hydroxyl-terminated polybutadiene resin and a coupling agent. The adhesive has good adhesion to a polyimide film which is an advanced insulating material and is poor in adhesive force, is good in insulating property, does not contain a solvent, conforms to the low-carbon emission reduction direction, has outstanding environmental protection property and safety, and has a wide application prospect. 本发明公开了一种绝缘材料复合用无溶剂胶黏剂及其制备方法，属绝缘材料胶粘剂领域。剂胶黏包括A组分与B组分，A组分与B组分的质量比为