Method for producing electronic component and electronic component
The invention relates to a method for producing an electronic component, comprising the following steps: providing a carrier (1) having a mounting surface (2) on which an electronic semiconductor chip (3) is arranged, providing a connecting element (7) having a first main surface (8), applying a fir...
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creator | RAMCHEN, J ¨ 1 RGEN STRAUSS STEFFEN MAHFELD JAMIE SORG, JU RG ERICH M ¨ 1 LLER, KLAUS WOLTER JAN |
description | The invention relates to a method for producing an electronic component, comprising the following steps: providing a carrier (1) having a mounting surface (2) on which an electronic semiconductor chip (3) is arranged, providing a connecting element (7) having a first main surface (8), applying a first frame-shaped metallization (6) to or above the carrier (1) and applying a first frame-shaped solder reservoir (10) above the first main surface (8) of the connecting element (7); or applying a first frame-shaped metallization (6) over a first main surface (8) of the connecting element (7) and applying the first frame-shaped solder reservoir (10) to or over the carrier (1), the width (BL) of the first frame-shaped solder reservoir (10) being smaller than the width (BM1) of the first frame-shaped metallization (6), and-liquefying the solder of the first frame-shaped solder reservoir (10), thereby forming a first frame-shaped solder layer (16), which connects the carrier (1) and the connecting element (7) to each o |
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or applying a first frame-shaped metallization (6) over a first main surface (8) of the connecting element (7) and applying the first frame-shaped solder reservoir (10) to or over the carrier (1), the width (BL) of the first frame-shaped solder reservoir (10) being smaller than the width (BM1) of the first frame-shaped metallization (6), and-liquefying the solder of the first frame-shaped solder reservoir (10), thereby forming a first frame-shaped solder layer (16), which connects the carrier (1) and the connecting element (7) to each o</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240308&DB=EPODOC&CC=CN&NR=117678059A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240308&DB=EPODOC&CC=CN&NR=117678059A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>RAMCHEN, J ¨ 1 RGEN</creatorcontrib><creatorcontrib>STRAUSS STEFFEN</creatorcontrib><creatorcontrib>MAHFELD JAMIE</creatorcontrib><creatorcontrib>SORG, JU RG ERICH</creatorcontrib><creatorcontrib>M ¨ 1 LLER, KLAUS</creatorcontrib><creatorcontrib>WOLTER JAN</creatorcontrib><title>Method for producing electronic component and electronic component</title><description>The invention relates to a method for producing an electronic component, comprising the following steps: providing a carrier (1) having a mounting surface (2) on which an electronic semiconductor chip (3) is arranged, providing a connecting element (7) having a first main surface (8), applying a first frame-shaped metallization (6) to or above the carrier (1) and applying a first frame-shaped solder reservoir (10) above the first main surface (8) of the connecting element (7); 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or applying a first frame-shaped metallization (6) over a first main surface (8) of the connecting element (7) and applying the first frame-shaped solder reservoir (10) to or over the carrier (1), the width (BL) of the first frame-shaped solder reservoir (10) being smaller than the width (BM1) of the first frame-shaped metallization (6), and-liquefying the solder of the first frame-shaped solder reservoir (10), thereby forming a first frame-shaped solder layer (16), which connects the carrier (1) and the connecting element (7) to each o</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | Method for producing electronic component and electronic component |
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