Method for producing electronic component and electronic component

The invention relates to a method for producing an electronic component, comprising the following steps: providing a carrier (1) having a mounting surface (2) on which an electronic semiconductor chip (3) is arranged, providing a connecting element (7) having a first main surface (8), applying a first frame-shaped metallization (6) to or above the carrier (1) and applying a first frame-shaped solder reservoir (10) above the first main surface (8) of the connecting element (7); or applying a first frame-shaped metallization (6) over a first main surface (8) of the connecting element (7) and applying the first frame-shaped solder reservoir (10) to or over the carrier (1), the width (BL) of the first frame-shaped solder reservoir (10) being smaller than the width (BM1) of the first frame-shaped metallization (6), and-liquefying the solder of the first frame-shaped solder reservoir (10), thereby forming a first frame-shaped solder layer (16), which connects the carrier (1) and the connecting element (7) to each o