INTEGRATED CIRCUIT DEVICE INCLUDING BACKSIDE POWER

Integrated circuit devices and methods of forming the same are provided. The integrated circuit device may include: a lower insulating structure; a transistor on the lower insulating structure, the transistor including a source/drain region; a power rail structure in the lower insulation structure;...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HONG WON-HYUK, LEE JONG JIN, SEO KANG-ILL, JEONG MYUNG-HUN, BAEK JAE-JIK
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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