Server
The embodiment of the invention provides a server. The server includes: a circuit board; the first heating element is arranged on the circuit board; the at least one first heat dissipation piece is used for dissipating heat of the first heating element; the heat dissipation block is in heat conducti...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The embodiment of the invention provides a server. The server includes: a circuit board; the first heating element is arranged on the circuit board; the at least one first heat dissipation piece is used for dissipating heat of the first heating element; the heat dissipation block is in heat conduction connection with the at least one first heat dissipation piece, and a containing space is formed in the heat dissipation block; the heat dissipation pipeline is used for conducting heat dissipation on the heat dissipation block, the heat dissipation pipeline comprises an inlet end and an outlet end, the inlet end is used for inputting a cooling working medium, the outlet end is used for outputting the cooling working medium, the heat dissipation pipeline is arranged in the containing space, and at least part of the surface of the heat dissipation pipeline is in surface contact with at least part of the surface of the heat dissipation block. According to the embodiment of the invention, the contact area of the hea |
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