Printed circuit board black shadow process capable of inhibiting aeration and printed circuit board
The invention provides a printed circuit board black shadow process capable of inhibiting aeration and a printed circuit board. The black shadow process for inhibiting aeration of the printed circuit board comprises the following steps: acquiring a substrate to be subjected to black shadow; performi...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a printed circuit board black shadow process capable of inhibiting aeration and a printed circuit board. The black shadow process for inhibiting aeration of the printed circuit board comprises the following steps: acquiring a substrate to be subjected to black shadow; performing black shadow operation on the substrate by adopting black shadow equipment capable of inhibiting the circulation operation aeration of the black shadow liquid medicine so as to reduce the bubble generation amount of the black shadow liquid medicine in the circulation process, so that the black shadow liquid medicine can form a conductive film with good conductivity on the hole wall surface of the substrate; and carrying out electroplating operation on the substrate subjected to the black shadow operation so as to form an electroplating copper metal layer on the conductive film. By adopting the process, the phenomenon that the black shadow liquid medicine is easy to generate aeration in the circulating operation |
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