OPA chip end face ultrasonic polishing system

The invention discloses an OPA chip end face ultrasonic polishing system, and relates to the technical field of chip machining. Comprising a base, and an ultrasonic polishing box and a cleaning box are arranged on the base; a positioning tool piece is arranged on the base and used for positioning an...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KANG DAE-SUNG, WANG JIAJUN, ZHUANG YATING, WANG LIANG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses an OPA chip end face ultrasonic polishing system, and relates to the technical field of chip machining. Comprising a base, and an ultrasonic polishing box and a cleaning box are arranged on the base; a positioning tool piece is arranged on the base and used for positioning and installing a workpiece. The positioning tool part comprises a sliding seat slidably mounted on the base, a mounting frame is fixedly connected to the sliding seat, a rotating disc is rotatably mounted on the mounting frame, a positioning frame is slidably arranged on the rotating disc in a lifting manner, and positioning through holes arranged in a circular array are formed in the positioning frame; point position supporting pieces are arranged on the upper end face and the lower end face of the positioning frame correspondingly and arranged on the positioning frame in a circular array mode. The workpiece is supported and positioned through the point position supporting pieces corresponding to the upper and lower