Semiconductor substrate assembly and method for manufacturing same

According to one embodiment of the present disclosure, a bonding structure is provided with: a first substrate having a first bonding surface having a first signal transmission metal region and a first ground metal region insulated from the first signal transmission metal region; and a second substrate bonded to the first substrate and having a second bonding surface, the second bonding surface having a second signal transmission metal region and a second ground metal region insulated from the second signal transmission metal region, the first signal transmission metal region and the second signal transmission metal region being bonded to each other, and the first grounding metal region and the second grounding metal region are jointed. 根据本公开的一实施方式，提供一种接合构造，其中，具备：第一基板，具有第一接合面，所述第一接合面具有第一信号传输金属区域和与所述第一信号传输金属区域绝缘的第一接地金属区域；及第二基板，与所述第一基板接合，具有第二接合面，所述第二接合面具有第二信号传输金属区域和与所述第二信号传输金属区域绝缘的第二接地金属区域，所述第一信号传输金属区域和所述第二信号传输金属区域被接合，且所述第一接地金属区域和所述第二接地金属区域被接合。