Chip processing method

The invention relates to the technical field of chip production, and particularly discloses a chip processing method, which comprises the following steps of: stacking a plurality of single-layer wafers, and welding two adjacent single-layer wafers to form a composite wafer; cutting the composite wafer to form a plurality of composite chips; and respectively welding each composite chip to the surface of one side of a substrate. In the chip processing process, firstly, a plurality of single-layer wafers are stacked and then welded into a composite wafer, then the composite wafer is cut into composite chips with required sizes, and finally, the composite chips are welded to the surface of one side of the substrate. Compared with a traditional chip processing method, the method has the advantages that the single-layer wafers are compounded and then directly cut into the needed composite chips, the composite chips and the substrate are welded only through one-time confirmation and recognition, the effect of the mu