Sensor module for detecting vibration behavior of component
A sensor module (8) configured to detect mechanical vibrations of a component part (4), the sensor module (8) comprising: a base (12) comprising a central portion (24), a first end portion (26) and a second end portion (28), the base (12) configured to be fixed on the component part (4); at least on...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | chi ; eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| Zusammenfassung: | A sensor module (8) configured to detect mechanical vibrations of a component part (4), the sensor module (8) comprising: a base (12) comprising a central portion (24), a first end portion (26) and a second end portion (28), the base (12) configured to be fixed on the component part (4); at least one spacer (14) connected to the base (12); and a circuit board (18) connected to the base (12) by at least one spacer (14), a central portion (24) of the base (12) being provided with a concave edge (52) defining a width of the central portion (24) and an opposite convex edge (54), the at least one spacer (14) being connected to the central portion (24) of the base (12) near the concave edge (52) relative to the convex edge (54).
一种传感器模块(8)被配置为检测组成部件(4)的机械振动，传感器模块(8)包括：基部(12)，包括中心部分(24)、第一端部分(26)和第二端部分(28)，基部(12)被构造为固定在组成部件(4)上；至少一个间隔件(14)，连接到所述基部(12)；以及电路板(18)，通过至少一个间隔件(14)连接到基部(12)，基部(12)的中心部分(24)设置有限定中心部分(24)的宽度的凹形边缘(52)和相对的凸形边缘(54)，至少一个间隔件(14)连接到基部(12)的中心部分(24)的相对于凸形边缘(54)靠近凹形边缘(52)处。 |
|---|