Adhesive sheet for semiconductor processing and method for manufacturing semiconductor device

The present invention relates to an adhesive sheet for semiconductor processing and a method for manufacturing a semiconductor device using the same, the adhesive sheet for semiconductor processing having a surface coating layer, a buffer layer, a base material, and an adhesive layer in this order,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ADACHI ISSEI, UMEZAWA MASAHIRO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	The present invention relates to an adhesive sheet for semiconductor processing and a method for manufacturing a semiconductor device using the same, the adhesive sheet for semiconductor processing having a surface coating layer, a buffer layer, a base material, and an adhesive layer in this order, the surface coating layer containing a styrene-based resin, the buffer layer containing a styrene-based resin, the base material containing a styrene-based resin, and the adhesive layer containing a styrene-based resin. The content of a structural unit derived from a styrene-based compound in the styrene-based resin is 50 mass% or more. 本发明涉及半导体加工用粘合片以及使用该半导体加工用粘合片的半导体装置的制造方法，所述半导体加工用粘合片依次具有表面涂层、缓冲层、基材及粘合剂层，所述表面涂层含有苯乙烯类树脂，所述苯乙烯类树脂中的源自苯乙烯类化合物的结构单元的含量为50质量％以上。