Preparation method for enhancing local flexibility resistance of chip on film

The invention discloses a preparation method for enhancing local bending resistance of a chip on film, the top of a base is connected with the bottom of a turntable through a first motor, the top of the turntable is provided with limiting seats in an annular array shape, the limiting seats are provi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SUN MANHUI, ZHAO YIHUI, WANG HONGQING
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a preparation method for enhancing local bending resistance of a chip on film, the top of a base is connected with the bottom of a turntable through a first motor, the top of the turntable is provided with limiting seats in an annular array shape, the limiting seats are provided with limiting grooves, and the turntable is rotatably connected with the base through a rotating block; a cushion block is connected into the limiting groove and connected with the rotary disc through a first reset spring, and meanwhile through holes are correspondingly formed in the rotary disc and the base. According to the preparation method for enhancing the local flexibility resistance of the chip on film, under the driving of a material pump, solder mask ink in a storage groove enters a movable spray gun in a printing mechanism through a conveying pipeline, and the movable spray gun movably sprays out the solder mask ink to treat the side wall of an IC mounting groove; according to the device, the anti-we