Glass core substrate comprising stacks having different numbers of layers

Embodiments described herein may relate to apparatuses, processes, and techniques for glass core-based substrates having an asymmetric number of front side and back side copper layers. In embodiments, the front-side and/or back-side copper layers may be referred to as stacks or stacks on a glass core substrate. Embodiments may allow for a lower overall number of substrate layers by reserving more front-side layers, where signal routing may typically be highest, without requiring a matched or symmetric number of back-side copper layers. Other embodiments may be described and/or claimed. 本文中描述的实施例可涉及针对基于玻璃芯的衬底的设备、过程和技术，所述衬底具有不对称数量的前侧和后侧铜层。在实施例中，前侧和/或后侧铜层可称为玻璃芯衬底上的叠层或堆积层。实施例可通过预留出更多的前侧层(其中信号路由可通常最高)而不要求匹配或对称数量的后侧铜层，来允许更低的总体衬底层数。可描述和/或要求保护其它实施例。