Manufacturing method of multicolor printed circuit for smart card module
A method of manufacturing a flexible printed circuit for a smart card module is provided in which a composite material is provided. The composite material includes a set of laminations of at least two different colors. The zones (64, 65, 66, 67) of composite material are visible through the layer (6...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A method of manufacturing a flexible printed circuit for a smart card module is provided in which a composite material is provided. The composite material includes a set of laminations of at least two different colors. The zones (64, 65, 66, 67) of composite material are visible through the layer (60) of conductive material. The method of manufacture includes an operation that includes laser etching the stack on a portion of the regions (64, 65, 66, 67) of the group of visual stacks to expose the other one of two stacks of different colors. Also included are a printed circuit manufactured by the method, a module and a smart card comprising the printed circuit.
本申请提供一种用于智能卡模块的柔性印刷电路的制造方法,其中提供有复合材料。所述复合材料包括一组至少两个不同颜色的叠层。所述复合材料的区(64,65,66,67)通过导电材料层(60)是可见的。所述制造方法包括一个操作,该操作包括激光蚀刻所述可视叠层的所述组的所述区(64,65,66,67)的一部分上的所述叠层,以暴露两个不同颜色的叠层中的另一个颜色。还包括一种由所述方法制造的印刷电路、一种模块和包括所述印刷电路的智能卡。 |
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