Sensing device and manufacturing method thereof

A sensing device includes a substrate, a circuit layer disposed on the substrate, a photosensitive element disposed on the substrate and electrically connected to the circuit layer, a light shielding layer disposed on the photosensitive element and having an opening, the opening overlapping the photosensitive element, and a conductive layer disposed on the light shielding layer, and the conductive layer passes through the opening and is electrically connected with the photosensitive component. The invention also provides a manufacturing method of the sensing device. 本公开提供一种感测装置，包含基板、电路层、感光组件、遮光层以及导电层，电路层设置于基板上，感光组件设置于基板上且与电路层电性连接，遮光层设置于感光组件上且具有开口，开口与感光组件重叠，导电层设置于遮光层上，且导电层穿过开口并与感光组件电性连接。本公开亦提供一种感测装置的制作方法。