SEMICONDUCTOR CONDUCTIVE POLE DEVICE AND METHOD

The invention relates to a semiconductor conductive pillar apparatus and a method. Apparatuses and methods including stacked die devices and systems are disclosed herein. Example stacked die devices and methods include an array of interconnect pillars including more than one pillar height. Example stacked die devices and methods include an array of interconnect pillars including a pillar height distribution mapped to a known warpage profile. 本申请涉及半导体导电柱装置和方法。本文公开了包含堆叠裸片装置和系统的设备和方法。示例堆叠裸片装置和方法包含互连柱阵列，所述互连柱阵列包含多于一个柱高度。示例堆叠裸片装置和方法包含互连柱阵列，所述互连柱阵列包含映射到已知翘曲轮廓的柱高度分布。