Molded electronic device

The invention discloses a molded electronic device. The molded electronic device comprises a bent substrate, a first circuit layer, a dielectric layer, a segment difference compensation layer and a second circuit layer. The curved substrate has a first surface. The first circuit layer is arranged on...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WEI XIAOFEN, ZHANG ZHIJIA, PENG YUMING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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